Bildergalerie: Description 50806801 in Directory 29

IBM <>

DTXT_TITLE: IBM 300mm manufacturing facility at East Fishkill, NY, USA (2005)
DOC_TYPE: Image
ARCHIV: 1000
FIL_ID: 50806801
FIL_ORG: 84910.jpg
FIL_EXT: jpg
FIL_WIDTH: 2705
FIL_HEIGHT: 2008
FIL_RES: 300
FIL_SIZE: 7097025
FIL_COLOR: RGB
FIL_ROTATE:
FIL_CLIP:
FIL_CROP:
FIL_IMG:
FIL_PATH:
DOC_SPERRVERMERK:
DOC_INPUT: 19-12-2005 14:12:51
DOC_UPDATE: 19-12-2005 14:18:30
DOC_STATUS: 1
DOC_KATALOG: 1
DOC_SPERR: 1
BESCHREIBUNG: IBM innovations in microelectronics have transformed the world of semiconductors. Among the breakthroughs are Copper Conductors, Silicon Germanium (SiGe), Silicon on Insulator (SOI) and Strained Silicon. These advanced processes are used to manufacture semiconductor chips in an IBM 300mm manufacturing facility at East Fishkill, NY, USA.
BU:
RUBRIK: Forschung Technologie Fertigung
BILDART: Innenaufnahme
STICHWORTE: Chip, Produktion, Fabrikation, Chipherstellung, Wafer, Plant
IBM_NUMMER: 84910
FARBE: farbig
FORMAT: Quer
ORIGINAL: Digital
BILDRECHTE: IBM
BILDQUELLE: IBM Pressroom USA - Microelectronics: Bild #19009
EINGABE: Häßler
EXPORTPATH: 29/images/50806801.jpg

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