Bildergalerie: Description 50829537 in Directory 30

IBM <>

DTXT_TITLE: IBM 300-Millimeter-Chip-Fertigung in East Fishkill, NY, USA (2006)
DOC_TYPE: Image
ARCHIV: 1000
FIL_ID: 50829537
FIL_ORG: 86118.tif
FIL_EXT: jpg
FIL_WIDTH: 1266
FIL_HEIGHT: 940
FIL_RES: 72
FIL_SIZE: 2508607
FIL_COLOR: CMYK
FIL_ROTATE:
FIL_CLIP:
FIL_CROP:
FIL_IMG:
FIL_PATH:
DOC_SPERRVERMERK:
DOC_INPUT: 27-10-2006 16:44:08
DOC_UPDATE: 25-10-2007 13:35:16
DOC_STATUS: 1
DOC_KATALOG: 1
DOC_SPERR: 1
BESCHREIBUNG: QUALCOMM SELECTS IBM, CHARTERED, SAMSUNG CHIP PARTNERSHIP. IBM's state-of-the-art 300mm chip plant in East Fishkill, N.Y., is one of three such sites selected by QUALCOMM to produce chips for its wireless communications products. IBM, Chartered and Samsung are founders of a unique 'Common Platform' collaboration that allows QUALCOMM the flexibility to manufacture nearly identical chips at any one of three separate facilities around the world.
BU:
RUBRIK: Forschung Technologie Fertigung
BILDART: Innenaufnahme
STICHWORTE: Chip, Halbleiter, Halbleiterfertigung, Produktion, Wafer, Fabrikation, Chip, Chipherstellung, Wafer, Plant
IBM_NUMMER: 86118
FARBE: farbig
FORMAT: Quer
ORIGINAL: Digital
BILDRECHTE: IBM
BILDQUELLE: IBM Pressroom USA - Photo Gallery
EINGABE: Dentz
EXPORTPATH: 30/images/50829537.jpg

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